First High Volume Via Process for Packaging and Integration of MEMS / CMOS

Silex Microsystems, a pure play MEMS foundry, offers a high density through silicon via technology that enables MEMS designs with significantly reduced form factor. The Through Silicon Via (TSV) process developed by Silex offers sub 50 μm pitch for through wafer connections in up to 600 μm thick substrates. Silex via process enables “all silicon” MEMS designs and true "Wafer Level Packaging" features that are particularly important in consumer market applications. The “via first” approach in this interconnect technology enables integration of interconnect functions in advanced sensors, actuators and microfluidic devices, as well as unrestricted integration of MEMS and CMOS. A significant number of Silex foundry customers are already integrating this standard process into their MEMS designs in order to solve interconnect and packaging issues inherent in the commercialization process of MEMS. The high temperature formation process and “via first” approach also enables building CMOS sensors on top of via substrates, thereby facilitating the integration and interconnect of MEMS and